Memory card with raised portion

ABSTRACT

A peripheral card includes a circuit board, various circuit elements on the circuit board, a set of user terminals, a set of test terminals, and an enclosure that covers a portion of the circuit board and the circuit elements. The enclosure does not cover the user terminals and test terminals. After the peripheral card is tested, the test terminals are covered with a conformal contact coating in order to prevent access to the test terminals.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Application is related to U.S. patent application Ser. No.______“Method For Efficiently Producing Removable Peripheral Cards,” filedJun. 23, 2003, Hem P. Takiar, Atty. Docket SDK1P014/370, which isincorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is directed to technology for peripheral cards.

2. Description of the Related Art

Memory cards are relatively small removable cards that provide datastorage. In most cases, but not required in all cases, the memory cardis integrated circuit based. These memory cards plug into or arereceived by ports or connectors on electronic devices, includingcomputing devices, cameras, mobile telephones, PDAs and other devices.One example of a memory card uses non-volatile memory. ElectricalErasable Programmable Read Only Memory (EEPROM) and flash memory areamong the most popular non-volatile semiconductor memories. Someexamples of memory cards includes CompactFlash™, MMC™, Smart Media,Secure Digital™, and the Memory Stick.

A flash memory card is a memory card that has one or more arrays offlash memory cells. Some flash memory cards also include bit linedecoders, word line decoders, a state machine, a controller and othercircuitry. In many cases the controller will be implemented in a firstsemiconductor die, while the array of flash memory cells, bit linedecoders, word line decoders, and state machine are implemented in asecond semiconductor die. Over time, flash memory arrays have increaseddensity by shrinking the size of an individual memory cell and byimplementing greater numbers of memory cells in the array.

To maintain product reliability and customer satisfaction, manufacturersof memory cards will test the memory cards during the manufacturingprocess in order to determine if there are any manufacturing defects. Inmany cases, the user I/O pins on the memory card connect to thecontroller. However, a test performed during manufacturing typicallyseeks to directly access the memory array (bypassing the controller) inorder to test each cell in the memory array. Additionally, more pinswill allow for more efficient and complete testing of the relevantcomponents of the memory card. Thus, many memory cards will include testpins, in addition to the user I/O pins. To protect the memory card fromelectrostatic discharge relative to the test pins and to protect thedata on the card from being wrongfully accessed via the test pins, thetest pins should not be exposed to the user of the memory card after themanufacturing process.

One example of a memory card is described in U.S. Pat. No. 6,410,355(the '355 patent”), incorporated herein by reference in its entirety. Inthe '355 patent, a memory card using flash memory is manufactured with aset of test pins at one edge of the memory card. After the memory cardis tested, the test pins are cut off of the memory card and the memorycard is then packaged. While the device of the '355 patent has workedwell, there is a need for an improvement. First, the test pins that arecut off use real estate on the circuit board. There is a trend toincrease density on circuit boards; therefore, it would be advantageousto not use a portion of the circuit board for components that will notship to customers. Second, if the memory card fails in the field, thereare no test pins to test the device in order to determine why the memorycard failed. Such tests following device failure allow a manufacturer ofmemory cards to improve device reliability and the manufacturingprocess.

Another example of a memory card using flash memory is the recentlyreleased Mini-SD Card. In one commercial version of the Mini-SD Card,the memory array is mounted on the top of the circuit board and thecontroller is mounted on the memory array. User I/O pins and test pinsare formed on the bottom of the circuit board. After the memory card istested, the circuit board (with the controller, memory array and othercomponents) are enclosed by attaching a top lid to a bottom lid. Boththe bottom lid and the top lid are made of a hard plastic, and aremanufactured from a mold prior to enclosing the circuit board. After thetop and bottom lids are made, the top lid is ultra-sonically welded tothe bottom lid to enclose the circuit board (with the controller, memoryarray and other components). The bottom lid has an opening for the userI/O pins. The bottom lid does not have an opening for the test pins;therefore, the test pins are not exposed to users. There will be a smallair gap between the bottom lid and the bottom of the circuit board Whilethis design works well, the top and bottom lids are relatively expensiveto manufacture. Additionally, the lids are relatively bulky which limitshow small the memory cards can be manufactured. The trend in theindustry to further decrease the size of memory cards.

Thus, there is a need to provide for test pins for a memory card withoutthe limitations described above. Similar issues exist with other typesof peripheral cards, such as peripheral cards that implement wirelesscommunication devices, GPS devices, cellular devices, networkinterfaces, modems, disk storage systems, and other devices.

SUMMARY OF THE INVENTION

The present invention, roughly described, pertains to technology for aperipheral card with hidden test pins. One embodiment of the presentinvention includes a circuit board, circuit elements on said circuitboard, a set of user terminals on the circuit board that are incommunication with at least a subset of the circuit elements, a set oftest terminals on said circuit board that are in communication with oneor more of the circuit elements, an enclosure that covers a portion ofthe circuit board without covering the set of user terminals and the setof test terminals, and a conformal contact coating on a first surface ofthe circuit board covering the test terminals and preventing access tothe test terminals.

One embodiment of manufacturing such a peripheral card includes addingcircuit elements to a circuit board, where the circuit board (at somepoint in time) includes a set of test terminals. One or more of thecircuit elements are tested using the test terminals. The test terminalsare subsequently covered with a conformal contact coating in order toprevent access to the test terminals. In one implementation, the testterminals are covered with a conformal contact coating by applying aliquid directly to a first surface of the circuit board. In anotherimplementation, the test terminals are covered with a conformal contactcoating by applying a film directly to a first surface of said circuitboard.

Some embodiments of the present invention will include manufacturing theperipheral cards a batch at a time, followed by singulation of the batchinto individualized memory cards. The present invention allows for thecovering of the test pins before or after singulation. For example, oneimplementation includes the steps of adding circuit elements to aplurality of circuit boards of a strip (each of the plurality of circuitboards includes a set of test terminals), separating the connectedcircuit boards, testing the circuit elements of the circuit boards usingthe test terminals, and applying a conformal contact coating on a firstsurface of each of the circuit boards. The conformal contact coatingcovers the test terminals and prevents access to the test terminals suchthat a particular circuit board has its test terminals covered afterthat particular circuit board has been tested.

The present invention can be applied to the manufacture of memory cards,including flash memory cards. The technology disclosed herein can alsobe applied to other peripheral cards. For example, the present inventioncan be used with removable peripheral cards that include wirelesscommunication devices, GPS devices, cellular devices, networkinterfaces, modems, disk storage systems, and other devices. The presentinvention is not limited to any one type of peripheral card and is meantto be used with many different types of peripheral cards.

These and other objects and advantages of the present invention willappear more clearly from the following description in which thepreferred embodiment of the invention has been set forth in conjunctionwith the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the bottom of a memory card according toa first embodiment of the present invention.

FIG. 2 is a perspective view of the top of the memory card according tothe first embodiment of the present invention.

FIG. 3 is a first side view of the memory card according to the firstembodiment of the present invention.

FIG. 4 is a perspective view of the top of a memory card according to asecond embodiment of the present invention.

FIG. 5 is a perspective view of the top of a memory card according to athird embodiment of the present invention.

FIG. 6 is a perspective view of the top of a memory card according to afourth embodiment of the present invention.

FIG. 7 is a perspective view of the bottom of the memory card accordingto the fourth embodiment of the present invention.

FIG. 8 is a perspective view of the top of a memory card according to afifth embodiment of the present invention.

FIG. 9 is a perspective view of the bottom of the memory card accordingto the fifth embodiment of the present invention.

FIG. 10 is a side view of the memory card according to the fifthembodiment of the present invention.

FIG. 11 is a top view of a circuit board used for various embodiments ofthe present invention.

FIG. 12 is a bottom view of the circuit board used for variousembodiments of the present invention.

FIG. 13 is a cross section of an exemplar circuit board.

FIG. 14 is a cross sectional view of one embodiment of a circuit boardand various components on the circuit board during the manufacturingprocess.

FIG. 15 is a cross sectional view of one embodiment of a circuit boardand various components encapsulated on the circuit board during themanufacturing process.

FIG. 16 is a cross sectional view of one embodiment of a circuit boardand various components on the circuit board, with a conformal contactcoating applied to a surface of the circuit board.

FIG. 17 is a flow chart describing one embodiment of a process formanufacturing a memory card according to the present invention.

FIG. 18 is a plan view of a strip of memory cards prior to singulation.

FIG. 19 is a perspective view of the top of the memory card according toan additional embodiment of the present invention.

FIG. 20 is a perspective view of the bottom of the memory card accordingto the embodiment of FIG. 19.

FIG. 21 is a perspective view of the top of the memory card according toan additional embodiment of the present invention.

FIG. 22 is a perspective view of the bottom of the memory card accordingto the embodiment of FIG. 21.

DETAILED DESCRIPTION

FIGS. 1-10 depict various embodiments of a memory card. For example,FIG. 1 is a perspective view of the bottom of a memory card according toa first embodiment of the present invention. FIG. 2 is a perspectiveview of the top of the memory card according to the first embodiment ofthe present invention. FIG. 3 is a side view of the memory cardaccording to the first embodiment of the present invention. The memorycard of FIGS. 1-3 includes a top surface 10, a bottom surface, a frontsurface 12, a back surface 14 and two side surfaces. One of the sidesurfaces has an angle portion 16. Top surface 10 has a raised portion 18adjacent to back surface 14. Raised portion 18 allows the memory card tobe more easily grabbed by a human hand (or mechanical device) and alsoprovides additional room to store passive devices such as capacitorsand/or resistors. Note that raised portion 18 of FIG. 1 has a curvedprofile. The bottom surface includes a first portion 22 and a secondportion 24. Second portion 24 is raised from first portion 22. Firstportion 22 includes a set of user I/O pins 26 and corresponds to abottom surface of a circuit board, as discussed below.

In one implementation, the memory card is 12 mm wide and 15 mm long. Theangled portion is at a forty five degree angle. The thickness of thememory card is 0.9 mm at second portion 24, 1.0 mm at raised portion 18and 0.8 mm at first portion 22. In another embodiment, the thickness ofthe memory card is 0.8 mm at second portion 24, 1.0 mm at raised portion18 and 0.7 mm at first portion 22. In other embodiments, otherdimensions can also be used.

In one embodiment, a label will be placed on the top surface. This labelcan be a sticker or can be ink which is pad printed.

FIG. 4 is a perspective view of the top of a memory card according to asecond embodiment of the present invention. The second embodimentincludes a raised portion 18 a that has a straight profile. FIG. 5 is aperspective view of the top of a memory card according to a thirdembodiment of the present invention which does not include a raisedportion 18.

FIG. 6 is a perspective view of the top of a memory card according to afourth embodiment of the present invention. FIG. 7 is a perspective viewof the bottom of the memory card according to the fourth embodiment ofthe present invention. The fourth embodiment includes notch 30. Thenotch is used to secure the card in position when connected to a hostdevice.

FIG. 8 is a perspective view of the top of the memory card according toa fifth embodiment of the present invention. FIG. 9 is a perspectiveview of the bottom of the memory card according to the fifth embodimentof the present invention. FIG. 10 is a side view of the memory cardaccording to the fifth embodiment of the present invention. The fifthembodiment of the present invention implements a different orientationthan the other embodiments described above. For example, the top surfaceof the memory card in the fifth embodiment includes a raised portion 54adjacent back edge 52, which runs along the length as opposed to thewidth of the memory card. The memory card of the fifth embodimentincludes a front surface 50 that also runs along the length of thememory card. The bottom surface of the memory card includes a firstportion 54 and second portion 56. First portion 54 includes a set ofuser I/O pins 58 and corresponds to a bottom surface of a circuit board,as discussed below. Second portion 56 is raised from first portion 54.

FIG. 11 provides a top view of a circuit board used for variousembodiments of the present invention. FIG. 11 shows circuit board 200.Mounted on circuit board 200 are first die 202 and second die 204. Inone embodiment, die 202 includes a flash memory array with associatedcircuitry and die 204 includes a controller. In some embodiments, thememory card may include more than one memory array. In embodiments thatinclude a peripheral card other than a memory card, the dies can becomponents other than or in addition to memory arrays and controllers.Note that die 202 includes contacts 212 (e.g. die bond pads) which areused to connect die 202 to other components. Similarly, die 204 includescontacts 214 (e.g. die bond pads) to connect die 204 to othercomponents. Circuit board 200 also includes passive components 220,which could include capacitors and/or resistors. Circuit board 200includes a number of conductive traces (not shown) which interconnectthe devices mounted on the circuit board. Connecting regions (notdepicted) are provided on the circuit board so that the leads from diescan be connected to the circuit board by conventional wire bonding. Inother embodiments, other means different than wire bonding can be usedto connect the dies to the circuit board.

FIG. 12 shows the bottom of circuit board 200. In one embodiment, thebottom of circuit board 200 includes user I/O pins 230 and test pins232. FIG. 12 depicts eight user I/O pins 230 and sixteen test pins 232;however, different numbers of pins can also be used. The test pins 232can include data pins and/or power pins. The test pins are used to testone or more of the components of the memory card. For example, the testpins can be used to test each of the cells of the memory array. The userI/O pins 230 are used by a host device connected to the memory card inorder to communicate with the memory card. For example, the user I/Opins 230 can be used to communicate with the controller on die 204. Notethat in order to have a small package, one embodiment of the presentinvention includes mounting the integrated circuits on a first surfaceof the circuit board (e.g. the top surface) and forming the terminals(user I/O pins and test pins) on a conductive layer on another surfaceof the circuit board (e.g. the bottom surface).

FIG. 13 shows a cross sectional view of circuit board 200. FIG. 13 showsfive layers 260, 262, 264, 266, and 268. Other embodiments have lessthan or more than five layers. Layer 260, the middle layer, is aninsulating core layer. Layers 262 and 264 are routing layers, whichinclude conductive metal traces. Layers 266 and 268 include soldermasks. Connections between layers (such as layers 262 and 264) can bemade by conductive vias. In one embodiment, the circuit board is aprinted circuit board. In another embodiment, the circuit board is alead frame. Other types of circuit boards may also be used within thespirit of the present invention.

FIGS. 14-16 graphically depict the manufacturing process for creatingthe memory card according one embodiment of the present invention. FIG.14 is a side view of the memory card during the manufacturing process,prior to encapsulation. FIG. 14 depicts circuit board 200. Mounted oncircuit board 200 is die 202. Mounted on die 202 is die 204. FIG. 14shows die 202 and die 204 wire bonded to circuit board 200. FIG. 14 alsoshows passive devices 220, which can be capacitors and/or resistors. Inone embodiment, die 202 is mounted on circuit board 200 using anadhesive material. The adhesive material may be an epoxy adhesive, softsolder or any other adhesive material for mounting a die to a substrate.Die 204 is mounted on die 202 by way of an adhesive material applied tothe top surface of die 202 and the bottom surface of die 204. Moreinformation about stacking two dies on top of each other can be found inU.S. Pat. No. 5,502,289, incorporated herein by reference in itsentirety. In one embodiment, the passive devices are surface mountedusing solder.

FIG. 15 shows the memory card of FIG. 14 after encapsulation. That is,using an injection mold process or a transfer mold process, moldingmaterial 280 is used to encapsulate the components of the memory card.Note that the encapsulation covers the side surfaces, front surface,back surface, and top surface of circuit board 200. The encapsulationalso covers all the components mounted on the top surface of circuitboard 200. The bottom surface of circuit board 200, which includes userI/O pins 230 and test pins 232, is not covered by the encapsulation.

Subsequent to encapsulation, a conformal contact coating 290 is appliedto a portion of the bottom surface of circuit board 200 in order tocover test pins 232. The conformal contact coating does not cover userI/O pins 230. FIG. 16 depicts the memory card after the conformalcontact coating 290 has been applied. For example, the conformal contactcoating 290 is applied to portion 24 (see FIG. 1) of the bottom surfaceof the memory card, but not to portion 22 of the memory card. Theconformal contact coating protects the test pins from electrostaticdischarge and protects the data in the memory from unwanted access viathe test pins by blocking the test pins. The coating is a conformalcontact coating because it conforms to the shape of the surface it isbeing applied to and it is in direct contact to that surface. Some othermemory cards may use a lid to cover the bottom of the circuit board.That lid is not in contact with the bottom surface of the circuit board.Rather, an air gap will exist between the bottom lid and circuit board.Additionally, because the lid is prefabricated it will not conform tothe shape of the bottom surface of the bottom of the circuit board.

In one embodiment, the application of the conformal contact coatingincludes applying a liquid directly to the bottom surface of the circuitboard. The coating then dries to a solid. In another embodiment, thecoating is applied as a film directly to the bottom surface of thecircuit board. Examples of coatings include photoresist, solder mask,epoxy, thermoplastic, and polyimide. One specific example of a suitablecoating is the PSR-400 Solder Mask from Taiyo America, Inc.,www.taiyo-america.com. Examples of a film include mylar with an adhesiveor polyimide with an adhesive. An example of a suitable polyimide isKapton, by DuPont. One example of how to apply a liquid coating is touse a screen printing process.

FIG. 17 is a flowchart depicting one embodiment of a process formanufacturing a memory card according to the present invention. In step400, vias are drilled in the circuit board. In step 402, a top patternis applied to circuit board 200 to add the conductive traces andconnection regions discussed above. In step 404, a bottom pattern isapplied to the bottom surface of circuit board 200 to add the user I/Opins 230, 232 test pins and conductive traces. In step 406, solder maskis added to the top surface of circuit board 200. In step 408, thesolder mask is added to the bottom surface of circuit board 200. In step410, first die 202 is mounted to circuit board 200. In step 412, seconddie 204 is mounted to circuit board 200. In step 414, passive devices220 are mounted to circuit board 200. In step 416, wire bonds are addedto connect dies 202 and 204 to circuit board 200. In one embodiment,protective coatings are applied to the wire bonds and/or the dies. Instep 418, circuit board 200 and the components mounted on circuit board200 are subject to a transfer mold process so that the circuit board andits components are encapsulated, as described above. However, theencapsulation process of step 418 does not cover the bottom surface ofcircuit board 200.

In one embodiment, a memory card is manufactured as a unitary structure.In that case, step 420 is skipped and the process of FIG. 17 proceeds tostep 422. However, in other embodiments the memory cards are produced abatch at a time. That is, a strip of memory cards are produced at onetime and then a singulation process is performed to cut the strip intoindividualized memory cards. In the case where the memory cards areproduced at a batch at a time, step 420 includes cutting the strip toseparate the various memory cards. Step 420 is referred to assingulation.

In step 422, the memory cards are tested. In step 424, the test pins arecovered, as described above, by applying the conformal contact coatingto a portion of the bottom surface of the circuit board 200 (e.g. bottomportion 24 of FIG. 1).

Step 422 includes testing the memory cards. During the manufacturingprocess, the manufacturer may perform a burn-in test of the memory cardto verify that each of the memory cells in the memory array arefunctional. The manufacturer may then program the memory card to avoidbad memory cells. For example, the memory array may include a portion ofmemory that stores addresses for bad memory cells and pointers toreplacement memory cells. In some embodiments, the other components ofthe memory card may also be tested. Note that FIG. 17 shows that thedevices are tested and receive the conformal contact coating aftersingulation. In another embodiment, step 420 is performed after to step422; therefore, the various devices are tested and receive the conformalcontact coating prior to singulation.

FIG. 18 is a plan view of a strip of memory cards prior to singulation.FIG. 18 shows strip 500. On top of strip 500 are various instances ofthe memory cards. Each memory card is depicted in dashed lines. In oneembodiment, strip 500 includes 100 memory cards (5 wide, 20 long). Notethat other numbers of memory cards can also be manufactured on a strip.Strip 500 is manufactured by performing steps 400-418 simultaneously foreach of the memory cards on the strip. That is, the steps are performedon the strip as a whole. Step 420 is performed by cutting the strip intoseparate devices. According to one aspect of the present invention, thememory cards are not fully rectangular in their shape. Therefore, thesingulation of the strip into individual memory cards includes nonlinear(e.g. curvilinear) sawings. Such sawing can be performed efficientlywith a very thin saw with high precision and detail, such that thesawing action is very fine. Examples of the sawing devices include, forexample, a water jet cutting device, a laser cutting apparatus, a waterguided laser, a dry media cutting device, and a diamond coated wire.Water jet cutting may be the preferred cutting method given its smallcutting width (e.g. 50 microns), its ability to shape small features andits rapid cutting rate.

If the memory card fails after it is in use, then the failed memory cardcan be debugged by removing the conformal contact coating and using thetest pins to test the memory card.

FIG. 19 is a perspective view of the top of the memory card according toan additional embodiment of the present invention. FIG. 20 is aperspective view of the bottom of the memory card according to theembodiment of FIG. 19. Card 600 depicted in FIGS. 19 and 20 includesrounded notches 602 and 604, raised portion 606 and angled portion 608.Bottom surface 612 includes pins 620 and portion 622. Portion 622 israised from surface 612 and covers the test pins as described herein.

FIG. 21 is a perspective view of the top of the memory card according toan additional embodiment of the present invention. FIG. 22 is aperspective view of the bottom of the memory card according to theembodiment of FIG. 21. Card 700 depicted in FIGS. 21 and 22 includesnotch 702, raised portion 706 and angled portion 708. Bottom surface 712includes pins 726 and portion 722. Portion 722 is raised from surface712 and covers the test pins as described herein.

The description above specifically discusses memory cards. One set ofembodiments of the present invention specifically pertain to flashmemory cards, which include one or more memory arrays that utilize flashmemory technology. The embodiments explained above pertaining to memorycards are for example purposes and are not mean to limit the invention.The technology disclosed herein can also be applied to other peripheralcards that connect to a computing device and are controlled or operatedwith the computing device. One example of a removable peripheral card isa PCMCIA card. Examples of applications, in addition to memory systems,that can be implemented on peripheral cards include wirelesscommunication devices, GPS devices, cellular devices, networkinterfaces, modems, disk storage systems, etc. The present invention isnot limited to any one type of peripheral card and is meant to be usedwith many different types of peripheral cards.

The foregoing detailed description of the invention has been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise form disclosed. Manymodifications and variations are possible in light of the aboveteaching. The described embodiments were chosen in order to best explainthe principles of the invention and its practical application to therebyenable others skilled in the art to best utilize the invention invarious embodiments and with various modifications as are suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto.

1-51. (Cancelled).
 52. A non-volatile memory system, comprising: a cardhaving a set of contacts on an external surface of said card, said cardhaving a first surface and a second surface on an opposite side of saidcard from said first surface, said first surface having a raisedportion; a circuit board enclosed within said card; a plurality ofnon-volatile storage elements enclosed within said card and connected tosaid circuit board; and passive electrical elements enclosed within saidcard and connected to said circuit board, said passive electricalelements are positioned in a part of said card at least partiallydefined by said raised portion.
 53. A non-volatile memory systemaccording to claim 52, wherein: said non-volatile storage elements areflash memory cells.
 54. A non-volatile memory system according to claim52, wherein: said first surface defines a length and a width of saidcard.
 55. A non-volatile memory system according to claim 52, furthercomprising: a controller element enclosed within said card and connectedto said circuit board.
 56. A non-volatile memory system according toclaim 55, wherein: said passive electrical elements are in communicationwith said controller.
 57. A non-volatile memory system according toclaim 52, wherein: said first surface is a top surface of said card. 58.A non-volatile memory system according to claim 52, wherein: saidpassive electrical elements are capacitors.
 59. A non-volatile memorysystem according to claim 52, further comprising: side surfaces betweensaid first surface and said second surface.
 60. A non-volatile memorysystem according to claim 52, wherein: said raised portion provides agrip to grab said card.
 61. A non-volatile memory system according toclaim 52, wherein: said card includes molding material encapsulatingsaid circuit board, said non-volatile storage elements and said passiveelectrical elements.
 62. A non-volatile memory system according to claim52, wherein: said non-volatile storage elements are flash memory devicesin a flash memory array; and said passive electrical elements arecapacitors.
 63. A non-volatile memory system, comprising: a card havinga first dimension and a second dimension, said card has a firstthickness along a first portion of said first dimensions and a secondthickness along a second portion of said first dimension, said secondthickness is greater than said first thickness; a plurality ofnon-volatile storage elements enclosed within said card; and passiveelectrical elements enclosed within said card, said passive electricalelements are positioned in said second portion.
 64. A non-volatilememory system according to claim 63, wherein: said passive electricalelements are capacitors.
 65. A non-volatile memory system according toclaim 64, wherein: said first dimension is length; said second dimensionis width; and said non-volatile storage elements are flash memorydevices.
 66. A non-volatile memory system according to claim 63,wherein: said first dimension is length; and said second dimension iswidth.
 67. A non-volatile memory system according to claim 63, wherein:said passive electrical elements are in electrical communication withsaid non-volatile storage elements.
 68. A non-volatile memory systemaccording to claim 63, further comprising: a circuit board, saidnon-volatile storage elements and said passive electrical elements areconnected to said circuit board.
 69. A non-volatile memory systemaccording to claim 68, further comprising: a controller, said controlleris positioned within said card and is in communication with saidnon-volatile storage elements; and a set of electrical contacts on anexternal surface of said card, said set of electrical contacts are incommunication with said controller.
 70. A non-volatile memory systemaccording to claim 63, wherein: said non-volatile storage elements areflash memory devices.
 71. A non-volatile memory system according toclaim 63, further comprising: a controller element enclosed within saidcard and in communication with said non-volatile storage elements.
 72. Anon-volatile memory system according to claim 63, wherein: said cardhaving a first surface and a second surface on an opposite side of saidcard from said first surface, said first surface having a raisedportion, said raised portion defines said second thickness.
 73. Anon-volatile memory system according to claim 63, wherein: said cardincludes molding material encapsulating said plurality of non-volatilestorage elements and said passive electrical elements.
 74. A method ofmaking a memory system, comprising: adding non-volatile storage elementsto a circuit; adding passive electrical components to said circuit; andencapsulating said circuit, including said non-volatile storage elementsand said passive electrical components, to form a memory card having afirst dimension and a second dimension, said memory card has a firstthickness along a first portion of said first dimensions and a secondthickness along a second portion of said first dimension, said secondthickness is greater than said first thickness, said passive electricalcomponents are positioned in said second portion.
 75. A method accordingto claim 74, further comprising: adding a controller to said circuitprior to said step of encapsulating.
 76. A method according to claim 75,further comprising: adding a first set of electrical contacts to anexternal surface of said memory card, said first set of electricalcontacts are in communication with said controller.
 77. A methodaccording to claim 74, wherein: said passive electrical componentsinclude capacitors.
 78. A method according to claim 74, wherein: saidnon-volatile storage elements are flash memory devices.
 79. A methodaccording to claim 74, wherein: said card has a first surface and asecond surface on an opposite side of said card from said first surface,said first surface includes a raised portion, said passive electricalcomponents are positioned in an area of said card at least partiallydefined by said raised portion.
 80. A non-volatile memory system,comprising: a peripheral card having a first dimension and a seconddimension, said card has a first thickness along a first portion of saidfirst dimensions and a second thickness along a second portion of saidfirst dimension, said second thickness is greater than said firstthickness; non-volatile storage elements enclosed within said peripheralcard; and a passive electrical component enclosed within said peripheralcard, said passive electrical element is positioned in said secondportion.
 81. A non-volatile memory system, comprising: a peripheral cardhaving a first surface and a second surface on an opposite side of saidcard from said first surface, said first surface having a raisedportion; a circuit board enclosed within said peripheral card; aplurality of non-volatile storage elements enclosed within saidperipheral card and connected to said circuit board; and a passiveelectrical component enclosed within said peripheral card and connectedto said circuit board, said passive electrical component is positionedin a part of said card at least partially defined by said raisedportion.